产品描述
FAE—SVM非接触式测厚机
Laser Vision Measurement 品管量测设备
产品特性（FEATURES）
- ◆使用Window’s视窗介面，中/英文化书面，操作简单。
- ◆手动量测锡膏厚度
- ◆手动测量长、宽及两锡膏间之距离（间距）
- ◆测量值可记录存档及列印
- ◆提供厚度分布统计图表及X_Bar_R管制表
- ◆自动计算制程能力指标CP、CPK、CPM
- ◆可依不同生产线分别作记录
- ◆可依基板厚度调整焦距
- ◆可做定时呼叫取样
- ◆All operations are easy and using Windows interface in Chinese/English version.
- ◆Survey thickness of tin solder by auto matica lly or manually.
- ◆Survey the length and width manually,and the gap of tin solder.
- ◆Calculate the measure of area, the measure of cross-section and the measure of volumn automatically.
- ◆All surveyed values can be recorded to a file and be printed to a report.
- ◆Provide the diagrams of thickness distribution and control diagrams of X_BAR_R.
- ◆Calculate man facture ability degree automatically(CP, CPK, CPM)
- ◆It can have proprietary record according to every different production ling.
- ◆It can adjust focus point in different thickness of PC boards.
- ◆It can be called to sample periodically.
适用（APPLECATION）
- ◆各式厚度量测数值取得统计分析
- ◆锡膏印刷机制程品管检查
- ◆锡膏印刷厚度良性测量
- ◆锡膏印刷成型，尺寸量测检查
- ◆提供其他物品测厚，测长，量测检查
- ◆Get the results of statistics and analysis about all surveyed values in every thickness degree.
- ◆Inspect the quality of solder printing process.
- ◆Survey the thickness benignancy of tin solder
- ◆Measure the dimension of tin solder
- ◆Provide thickness and dimension measurement function for other objects
功能（FUNCTION）
- ◆量测印刷锡膏厚度、长度、高度、间距。
- ◆提供厚度分布数值参考。
- ◆提供各种统计分析图表
- X管制图、 R管制图、厚度列表
X平均值管制图 单点列表
- ◆Surveying the thickness of printing tin solder, length ,height and interval.
- ◆Provide the references of thickness distribution values.
- ◆Provide the analysis of different measure of cross-section.
- ◆Calculate the measure of area and volumn automatically in object which to be surveyed.
- ◆Provide all diagrams of statistics and analysis.
Provide X control Diagram, R Control Diagram
and Thickness List Diagram. Provide X Average
Control Diagram, Single Point List Diagram.
付款方式︰
TT
交货期︰
5
